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Dow Corning® Electronics’ materials span applications across the entire electronics value chain from semiconductor fabrication through to final system assembly. Our materials are used to adhere, protect, and seal electronic components in applications in Automotive, Aviation / Aerospace, Military, Computer, Telecommunications and Consumer Electronics.
Choose from the selections below to help identify a Dow Corning product for your application:
Electronics Modules:
Board Coating
Encapsulating Circuits
Component Attachment
Potting Modules
Heat Sink Attach
Base Plate/Housing Attach
Module Sealing Electronic Modules
Sensors:
Component Attachment
Potting/Encapsulating Sensors
Housing Attach
Pin Sealing
Connectors:
Pin Sealing
Gasketing/Sealing Connectors
IC Packaging
Die Encapsulant Materials
Die Attach Adhesive Materials
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