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Primary uses of Dow Corning® and Dow Corning Toray Silicone®
encapsulants are to seal, protect, and preserve electrical characteristics of
integrated circuit packages. This a dispensable underfill effectively relieving
stress caused by the CTE (coefficient of thermal expansion) mismatch between
the silicon die and the substrate. These products have been successfully
demonstrated with typical dispensing or liquid injection molding equipment.
| Typ: One Part |
| Physikalische Form: Vacuum dispensable, low viscosity |
| Besondere Eigenschaften: Chemical adhesion, elastomeric silicone, Moisture pickup <0.2% at 85/85
conditions for >236 hours |
| Mögliche Anwendungen: Seal, Protect, preserve electrical characteristics of micro electronic
devices requiring good adhesion |
| Technical
Data | | Tutorial |
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