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Gels are a special class of encapsulants that cure to an extremely soft
material. They are used to provide high levels of stress relief to sensitive
circuitry. Gels perform many important functions in electronics. Their
major job is to protect electronic assemblies and components from adverse
environments by:
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Functioning as dielectric insulation
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Protecting the circuit from moisture and other contaminants
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Relieving mechanical and thermal stress on components
Dow Corning offers a line of standard gels,
a line of low-temperature gels for applications
requiring low-temperature performance.
A line of toughened gels for use where chemical
adhesion and dimensional stability are required,
and a line of specialty gels for applications
requiring low extractables, ultra-violet (UV) cure, or resistance to solvents
and fuels.
In addition, Dow Corning offers custom gels that can be quickly tailored to meet specific application needs
for properties such as color, viscosity, hardness, and cure rate.
Learn more from the Gels
Tutorial or if you are looking for processing information please refer to
the Gels and Encapsulants Processing
Tutorial.
Looking for a precured product, a strip or custom precision cut
pad? Dow Corning offers GelTek precured Connector
Sealant Pads and Strips, for electrical contact and wire seals, and GelTek
Sealant
Strips for sealing and corrosion prevention. These are found in our
Precured Gel - Pads
and Parts family.
PDF Links will download files in Adobe Acrobat PDF format. For technical
information, or to download the free Acrobat Reader, go to Acrobat help.
| Typ: Two-part, various cure speeds |
| Physikalische Form: 1:1 mix ratio by weight or volume, various viscosities |
| Besondere Eigenschaften: Cure accelerated by heat, wide operating temperature range (-45 to 150°C/-49
to 302°F) |
| Mögliche Anwendungen: Sealing and protecting, by coating, encapsulating, or potting, various
electronic devices, especially those with delicate components |
| Technical Data | | Gels
Tutorial |
|
| Typ: One or two-part, various cure speeds |
| Physikalische Form: 1:1 mix ratio by weight or volume, various viscosities |
| Besondere Eigenschaften: Cure accelerated by heat, wider operating temperature range than the other
types of gels (-80 to 200°C/-112 to 392°F) |
| Mögliche Anwendungen: Sealing and protecting, by coating, encapsulating, or potting, various
electronic devices, especially those with delicate components and exposure to
low temperatures |
| Technical Data | | Gels
Tutorial |
|
| Typ: Two-part, various cure speeds |
| Physikalische Form: 1:1 mix ratio by weight or volume, low viscosity |
| Besondere Eigenschaften: Chemical adhesion, dimensional stability, cure accelerated by heat, wide
operating temperature range (-45 to 150°C/-49 to 302°F) |
| Mögliche Anwendungen: Sealing and protecting, by coating, encapsulating, or potting, various
electronic devices, especially those with a need for stronger adhesion or
improved dimensional stability; Dow Corning® 3-4237 Dielectric Firm Gel, with
its exceptionally long working time, is especially suited for penetrating
intricate parts |
| Technical Data | | Gels
Tutorial |
|
| Typ: One or two-part, various cure speeds |
| Physikalische Form: 1:1 mix ratio by weight or volume |
| Besondere Eigenschaften: Cure accelerated by heat or initiated by UV exposure, low extractables,
resistance to solvents and fuels, wide operating temperature range (at least
-45 to 150°C/-49 to 302°F) |
| Mögliche Anwendungen: Sealing and protecting various electronic devices by coating, encapsulating,
or potting. Especially adapted to those with delicate components and a
need for low extractables, UV cure, or resistance to solvents and fuels. |
| Technical Data | | Gels
Tutorial |
|
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