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Dow Corning Electronics Introduces New Adhesives to Help Automotive
Suppliers Reduce Costs , Dow Corning® EA-6052 and Dow Corning® EA-6054 -
learn more from the Heat Cure
Adhesives Overview
Sealing, Bonding, and Adhering
Dow Corning offers a variety of noncorrosive silicone products for
electronic sealing, bonding and adhering applications. These adhesives
generally fall into three cure types.
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The first group are moisture cures, generally meant for room-temperature
processing.
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The second type (condensation cure) offers rapid room-temperature and
deep-section curing.
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The third type is heat cure for rapid processing. All convert to durable,
relatively low stress elastomers. Most will develop good, primerless adhesion
to a variety of common substrates including ceramics, reactive metals and
filled plastics.
Learn more from the Adhesives/Sealants
Tutorial.
PDF Links will download files in Adobe Acrobat PDF format. For technical
information, or to download the free Acrobat Reader, go to Acrobat help.
| Typ: Noncorrosive, one-part moisture curing RTV silicone elastomers |
| Physikalische Form: Nonflowing and flowable options; cures to flexible elastomer |
| Besondere Eigenschaften: Room temperature cure; opaque and translucent options; resists humidity and
other harsh environments; good dielectric properties; good adhesion to a
variety of common substrates; low stress |
| Mögliche Anwendungen: Sealing modules and housings; gasketing |
| Technical
Data | | Tutorial |
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| Typ: Two-part RTV silicone elastomers |
| Physikalische Form: Nonflowing; cures to flexible elastomer |
| Besondere Eigenschaften: Rapid cure and green strength at room temperature; deep section cure;
resists humidity and other harsh environments; good dielectric properties;
self-priming adhesion; low stress |
| Mögliche Anwendungen: Lid and housing seals; gasketing |
| Technical
Data | | Tutorial |
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| Typ: One- and two-part silicone elastomers |
| Physikalische Form: Non-flowing and flowable options; cures to flexible elastomer |
| Besondere Eigenschaften: Fast thermal cure; resists humidity and other harsh environments; good
dielectric properties; self-priming adhesion; low stress |
| Mögliche Anwendungen: Lid and housing seals; gasketing |
| Technical
Data | | Tutorial |
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