|
When markets demand smaller, faster, less expensive electronic devices and
assemblies, you respond. But smaller components, tighter lead spacing and
increased operating frequencies result in higher temperatures that can reduce
performance and reliability. Heat is the enemy of performance.
An emerging generation of Thermal Greases offer advantages in managing
thermal issues in advanced chips. A reprint of the cover story in the July
issue of Advanced Packaging is now available for viewing or download here
- Thermal
Conductivity in Advanced Chips.
Dow Corning can help you - Choose from a wide range of
ready-to-use thermal interface materials from Dow Corning Electronics
including: Adhesives, Gap
Fillers, Gels and Compounds we even supply Thermally Conductive Materials for Pad Manufacturing.
Challenge us to provide controlled ionic impurities grades or to formulate
completely new materials to meet your exact property and process needs.
Learn more from the Thermally Conductive
Materials Tutorial.
For information about our newest product, Dow Corning® brand DA-6534
Adhesive, click here.
Thermal White Papers
Looking for a precured material in pad or film form? Consider
our Thermal Interface
- Pads and Films family. Dow Corning offers:
-
Thin Thermal Interface materials - for low thermal resistance
interface
-
Gap Filler Thermal Interface materials - for use on irregular surfaces
-
Phase Change Thermal Interface materials - for very low mounting force and
very low thermal resistance
Not finding exactly what you are looking for? In
addition to existing products, Dow Corning provides a Fast Formulation service in which minor product modifications to color,
rheology, hardness, cure rate, etc., can be quickly formulated to meet your
exact needs.
Not exactly sure what product form you need? Connect here to our interactive
Product
finder for this family of materials.
PDF Links will download files in Adobe Acrobat PDF format. For technical
information, or to download the free Acrobat Reader, go to Acrobat help.
| Typ: One or two-part silicone elastomer |
| Physikalische Form: Nonflowable and flowable options; cures to flexible elastomer |
| Besondere Eigenschaften: Fast thermal cure, or RTV cure available; resists humidity and other harsh
environments; good dielectric properties; self-priming adhesion; low stress;
noncorrosive |
| Mögliche Anwendungen: Bonding hybrid integrated circuit substrates; heat sink attach; potting
power supplies |
| Technical
Data | | Tutorial |
|
| Typ: Two-part silicone elastomer |
| Physikalische Form: Flowable liquid; cures to flexible elastomer |
| Besondere Eigenschaften: Constant cure rate, regardless of sectional thickness or degree of
confinement; no post-cure required |
| Mögliche Anwendungen: Potting of high-voltage transformers and sensors; assembly of substrates to
heat sinks; gap fill material between heat sources and heat sinks |
| Technical
Data | | Tutorial |
|
| Typ: Two-part silicone gel |
| Physikalische Form: Low to moderate viscosity; cures to gel like material |
| Besondere Eigenschaften: Long working times, fast thermal cure; resists humidity and other harsh
environments; good dielectric properties; self-priming adhesion; low stress;
non-corrosive |
| Mögliche Anwendungen: Gap fill material between electronic heat sources and heat sinks |
| Technical
Data | | Tutorial |
|
| Typ: Non-curing, thermally conductive silicone paste |
| Besondere Eigenschaften: High thermal conductivity; low bleed; high-temperature stability |
| Mögliche Anwendungen: Gap fill material between heat sources and heat sinks |
| Technical
Data | | Tutorial |
|
| Typ: Two-part heat cure |
| Besondere Eigenschaften: Soft, good thermal conductivity, low viscosity |
| Mögliche Anwendungen: Base material for thermally conductive pads |
| Technical
Data | | Tutorial |
|
|
Ändern
