 | With increased miniaturization of
systems and increased circuit density, today’s electronics generate large
amounts of heat. These trends in electronics will continue to make removal
of this excess energy even more critical for future applications. If the
heat is not carried off and dissipated, the operational lifetime and
reliability of the electronics can be reduced. This is a problem that
needs to be addressed for everything from individual devices to electronic
modules and systems. |
| Heat sinks and fans are mechanical means that are
increasingly used to keep the temperature of the electronics at a minimum, but
materials also play a critical role. Materials are used to couple the
electronics and heat sinks or fan sinks, as well as to couple interfaces with
lids, baseplates and heat spreaders. Dow Corning supplies a wide variety
of wet dispensed as well as fabricated film and pad thermal interface materials
to fit the needs of your application. |  |
 | The wet dispensed materials include curing
adhesives, gels and encapsulants, plus non-curing compounds. These can be used
for virtually any device configuration and do an excellent job accommodating
high tolerances between surfaces. Check the tutorial on die attach materials
for other types of materials with excellent thermal conductivity. |
| Dow Corning also supplies many types of thermal
interface materials as fabricated films and pads without the need for
dispensing or curing. These include thin thermal pads, gap fillers and
phase change films. |  |
In addition, we supply more than materials. Dow Corning can help with
other concerns such as smooth equipment integration, process design, material
and systems testing, or identification of the right supplier of other items,
such as heat sinks. Dow Corning provides a single stop for a wide variety
of thermal solutions.
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